AAEON Adds UP Squared 6000, a powerful board powered by Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC

To expand vertical markets and accelerate AIoT deployments for clients, AAEON announced its introduction of UP Squared 6000, a high-performance industrial computing maker board at small form factor (101.6mm x 101.6mm) powered by Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC (formerly Elkhart Lake) to its expanding UP Family. With the next-generation IoT-enhanced processors, UP Squared 6000 delivers upgraded single-thread, multi-thread and graphical performances, and features Intel® Programmable Service Engine (PSE) and onboard TPM to accelerate and optimize AIoT vertical applications.

To drive optimal performances required for today’s vertical markets, such as robotics, smart agriculture, retail, and vision-intensive applications, UP Squared 6000, powered by Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC (formerly Elkhart Lake), delivers up to 1.7x single-thread performance, 1.5x multi-thread performance, and 2x graphical processing performance enabled by Intel® UHD Graphics (11th Generation GPU). By adopting the next-generation IoT-enhanced processors, UP Squared 6000 brings improved performance and efficiency in artificial intelligence deployments.

Expansion and scalability are critical in edge AIoT deployments. To meet the design requirements, UP Squared 6000 comes with multiple M.2 sockets for Intel® Myriad X module, NVMe storage, 5G connectivity and Wi-Fi5/6 modules. In addition, UP Squared 6000 features 40-pin GPIO (HAT-compatible) and 100-pin board-to-board connector (available in Intel® Atom® x6000E/RE SKUs only) for I/O expansions through a carrier board. With the carrier board, UP Squared 6000 will drive full potential of Intel® Programmable Service Engine by offering CAN Bus, QEP, additional dual GbE Ethernet ports, and RS-232 for industrial applications (the carrier board is available in SKUs with Intel Atom® x6425RE and Intel Atom® x6413E processors and is scheduled for official launch in Q2, 2022).

By integrating the carrier board, UP Squared 6000 can drive the potential of Intel® Programmable Service Engine (PSE) offering Out-of-Band (OOB) Management, allowing IT personnel to remotely manage manufacturing assets even when the operating system is unresponsive or the device is powered off.

With purpose-built housing, UP Squared 6000 can be expanded as UP Squared 6000 Edge featuring all I/O connectivity of the mainboard and IoT enhancements including Time-Sensitive Networking (TSN), Time-Coordinated Computing (TCC), in-band ECC, and onboard TPM 2.0. On the other hand, by integrating UP Squared 6000 mainboard and the additional carrier board, UP Squared 6000 can be offered as UP Squared 6000 Edge Computing kit to unlock Intel® Programmable Service Engine (PSE), and further accelerates computer vision and deep learning applications with its preloaded Intel® Distribution of OpenVINO™ toolkit.

For those interested in the trial version of the carrier board and Intel® Programmable Service Engine (PSE), the UP Squared 6000 Edge Computing Kit is scheduled to be launched in Q1, 2022 to meet the demands while the carrier board will be officially in the market by Q2.

more information: https://www.aaeon.com/en/ni/press-release-intel-atom-x6000e-maker-board-up-squared-6000